Study of the curing of an acetylene-terminated polyphenylene resin with thermal expansion measurements

The curing of an acetylene-terminated polyphenylene resin (Hercules H-Resin) was followed by thermal expansion measurements. This approach proved useful in optimizing the curing conditions of the resin. Curing the polymer in air led to the formation of carboxyl groups, whereas curing under nitrogen did not. The thermal expansion coefficient is a minimum (32 ppm deg^?1) for a cure cycle of 250°C for 30 min, followed by 350°C for 30 min. Heating at temperatures above 350°C led to degradation of the crosslinked polymer and an increase in the thermal expansion coefficient.