| Formation mechanism of ordered stress-relief patterns in a free sustained Cu film system |
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| 引用本文： | 陈苗根,谢建平,金进生,夏阿根,叶高翔. Formation mechanism of ordered stress-relief patterns in a free sustained Cu film system[J]. 中国物理 B, 2008, 17(2): 669-673 |
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| 作者姓名： | 陈苗根 谢建平 金进生 夏阿根 叶高翔 |
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| 作者单位： | Department of Physics, Zhejiang University, Hangzhou 310027,China;Department of Physics, Zhejiang University, Hangzhou 310027,China;Department of Physics, Zhejiang University, Hangzhou 310027,China;Department of Physics, Zhejiang University, Hangzhou 310027,China;Department of Physics, Zhejiang University, Hangzhou 310027,China |
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| 基金项目： | Project supported by the NationalNatural Science Foundation of China (Grant No 10574109), theZhejiang Provincial Science and Technology Department (Grant No2005C24008) and the Zhejiang Provincial Natural Science Foundation(Grant No. Y604064). |
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| 摘 要： | A nearly free sustained copper （Cu） film system has been successfully fabricated by thermal evaporation deposition of Cu atoms on silicone oil surfaces, and a characteristic ordered pattern has been systematically studied. The ordered pattern, namely, band, is composed of a large number of parallel key-formed domains with different width w but nearly uniform length L; its characteristic values of w and L are very susceptible to the growth period, deposition rate and nominal film thickness. The formation mechanism of the ordered patterns is well explained in terms of the relaxation of the internal stress in the films, which is related to the nearly zero adhesion of the solid-liquid interface. By using a two-time deposition method, it is confirmed that the ordered patterns really form in the vacuum chamber.
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| 关 键 词： | 有序模式 薄膜技术 内部压力 铜 |
| 收稿时间： | 2007-02-10 |
| 修稿时间： | 2007-07-25 |
Formation mechanism of ordered stress-relief patterns in a free sustained Cu film system |
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| Chen Miao-Gen,Xie Jian-Ping,Jin Jin-Sheng,Xia A-Gen and Ye Gao-Xiang. Formation mechanism of ordered stress-relief patterns in a free sustained Cu film system[J]. Chinese Physics B, 2008, 17(2): 669-673 |
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| Authors: | Chen Miao-Gen Xie Jian-Ping Jin Jin-Sheng Xia A-Gen Ye Gao-Xiang |
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| Affiliation: | Department of Physics, Zhejiang University, Hangzhou 310027,China |
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| Abstract: | A nearly free sustained copper (Cu) film system has beensuccessfully fabricated by thermal evaporation deposition of Cuatoms on silicone oil surfaces, and a characteristic ordered patternhas been systematically studied. The ordered pattern, namely, band,is composed of a large number of parallel key-formed domains withdifferent width $w$ but nearly uniform length $L$; itscharacteristic values of $w$ and $L$ are very susceptible to thegrowth period, deposition rate and nominal film thickness. Theformation mechanism of the ordered patterns is well explained interms of the relaxation of the internal stress in the films, whichis related to the nearly zero adhesion of the solid-liquidinterface. By using a two-time deposition method, it is confirmedthat the ordered patterns really form in the vacuum chamber. |
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| Keywords: | ordered pattern thin film internal stress |
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