| 纳米材料和纳米技术在印制线路板基材中的应用前景（5）——提高印制线路板基材的力学性能 |
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| 引用本文： | 张家亮.纳米材料和纳米技术在印制线路板基材中的应用前景（5）——提高印制线路板基材的力学性能[J].印制电路信息,2003(1):7-13. |
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| 作者姓名： | 张家亮 |
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| 作者单位： | 南美覆铜板厂有限公司,528231 |
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| 摘 要： | 本文论述了纳米复合材料对印制线路板基材力学性能的影响,由于力学性能的提高,可以优化设计印制线路 板基材的综合性能,为实现印制线路板基材的轻、薄、小提供了技术上的保证。
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| 关 键 词： | 纳米技术 印制线路板 基材 力学性能 |
| 修稿时间： | 2002年9月17日 |
Prospect of Nanomaterial and Nanotechnology on Printed Circuit Board Substrate(5)--Improvement of Mechanical Properties on Printed Cir-cuit Board Substrate |
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| Zhang Jialiang.Prospect of Nanomaterial and Nanotechnology on Printed Circuit Board Substrate(5)--Improvement of Mechanical Properties on Printed Cir-cuit Board Substrate[J].Printed Circuit Information,2003(1):7-13. |
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| Authors: | Zhang Jialiang |
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| Institution: | Zhang Jialiang |
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| Abstract: | In the paper, effect of mechanical properties on copper clad laminate using nanocomposite was introduced. Designing of synthetic properties on copper clad laminate must be optimized for improvement of mechardcal properties. At the same, provided technical guarantee to research the light, thin and small copper clad laminate. |
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| Keywords: | nano-technology printed circuit board (PCB) copper clad board mechanical property |
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