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| 高速高密度PCB设计的关键技术与进展 | |
| 引用本文： | 周胜海,张海泉,兰洋.高速高密度PCB设计的关键技术与进展[J].信阳师范学院学报(自然科学版),2005,18(3):357-361. |
| 作者姓名： | 周胜海 张海泉 兰洋 |
| 作者单位： | 1. 信阳师范学院物理与电子工程学院,河南信阳,464000 2. 郑州师范高等专科学校,河南郑州,450054 3. 信阳师范学院计算机系,河南信阳,464000 |
| 基金项目： | 河南省自然科学基金资助项目(0311012500) |
| 摘 要： | 高速高密度是许多现代电子产品的显著发展趋势之一,高速高密度PCB设计技术即成为一个重要的研究领域.本文介绍了高速高密度PCB设计的关键技术问题(信号完整性、电源完整性、EMC/EMI和热分析)和相关EDA技术的新进展,讨论了高速高密度PCB设计的几种重要趋势. |
| 关 键 词： | 高速高密度PCB 信号完整性 电源完整性 EMC 热分析 EDA |
| 文章编号： | 1003-0972（2005）03-0357-05 |
| 收稿时间： | 2004-12-21 |
| 修稿时间： | 2004-12-21 |
Key problems and latest technques in high-speed and high-density PCB design |
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| ZHOU Sheng-hai,ZHANG Hai-quan,LAN Yang.Key problems and latest technques in high-speed and high-density PCB design[J].Journal of Xinyang Teachers College(Natural Science Edition),2005,18(3):357-361. | |
| Authors: | ZHOU Sheng-hai ZHANG Hai-quan LAN Yang |
| Abstract: | High-speed and high-density is a striking development trend of modern electronic products.The high-speed and high-density PCB design techniques would develop an important direction.Such specific key problems as signal integrity,power integrity,EMC/EMI,and thermal analysis about high-speed and high-density PCB design were outlined,the new relevant EDA techniques were introduced,and several important trends were discussed. |
| Keywords: | high-speed and high-density PCB signal integrity power integrity EMC PCB thermal analysis EDA |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ | |