微电子元件制造过程中的应力分析

本文分析了一个典型的微电子元件在创造过程中残余应力的分布和演化．与以往大多数类似的分析工作的不同之处在于，我们并不是对一个已成型的结构再回过头去仅仅分析其温度历史下相应的应力状态，而是追踪了该结构成型过程的各个方面，尤其是由于工艺过程中结构几何形状的变化而引起的应力重分布．采用的方法则是控制某些材料所对应的单元在某一特定的时刻以后才起作用，这种方法对于各种制造过程的分析非常有效．

Stress analysis of a microelectronic component during manufacturing process

The residual stress distributions of a typical microelectronic component during manufacturing process and their evolution is discussed in this paper. Unlike the majority of the simular work,instead of analysing the stress state just induced by the temperature history of a estasblished structure, we attempt to simulate every aspect during the process, especially the stress rearrange ment induced by configuration changing. The method we used is to control some elements to come into action at the very chosed time. This approach is proved to be very effective to simulate variable manufacturing process.