| 片式电容层压机的结构原理及其工艺 |
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| 引用本文： | 许耿睿,林伟强.片式电容层压机的结构原理及其工艺[J].电子工艺技术,2006,27(6):364-365,369. |
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| 作者姓名： | 许耿睿 林伟强 |
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| 作者单位： | 广东风华高新科技股份有限公司,广东,肇庆,526060 |
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| 摘 要： | 层压是片式多层陶瓷电容器生产过程中一道重要工序,关键是压力的控制,要求压力上升平稳,恒压时间控制精确,且电容巴块在各个方向受压均匀,使其结构致密.根据片式电容器的层压工艺要求,简要介绍了层压设备的结构、功能及工作原理.
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| 关 键 词： | 片式电容器 层压机 电子专用设备 |
| 文章编号： | 1001-3474（2006）06-0364-03 |
| 收稿时间： | 2006-09-12 |
| 修稿时间： | 2006-09-12 |
Structure Principle and Technology of the Chip Capacitor Press Machine |
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| XU Geng-rui,LIN Wei-qiang.Structure Principle and Technology of the Chip Capacitor Press Machine[J].Electronics Process Technology,2006,27(6):364-365,369. |
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| Authors: | XU Geng-rui LIN Wei-qiang |
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| Institution: | Guagndong Fenghua Advanced Technology Holding co. , Ltd. , Zhaoqing 526060, China |
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| Abstract: | laminating is a important working procedure of the manufacture process of the multilayer ceramic chip-capacitor,the key is controlling pressure.steadily rising the pressure,accurately controlling the isobarically time,and the capacitor body being pressing equably at every point,will make it's configuration compact,According to the laminated technical requirement of the chip capacitor,simply introduce the configuration,function and working theory of laminated equipments. |
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| Keywords: | Chip capacitor Press machine Electronic special equipment |
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