| Abstract: | Thermal degradation of the silica–aminopropylsilane–amic acid/imide interface was studied by modifying a high-surface-area, neutral silica gel with a number of substituted aminopropylsilanes (APS). These substrates were reacted further with phthalic anhydride or aromatic amic acid monomers and the thermal decomposition of the adsorbed/reacted materials was monitored by thermogravimetric analysis (TGA) and infrared (IR) spectroscopy. The 3-aminopropyltriethoxysilane/poly[N,N′-(p,p′-oxydiphenylene)pyromellitimide] interface was also evaluated by this method. Comparison clearly distinguishes the thermal decomposition of surface-bound APS from surface-bound alkylphthalimides, the adhesion product of alkylamines and aromatic amic acids. Alkylamine imidization with the elimination of aromatic amine (analogous to polymer scission) and the decomposition of the surface-bound imide are shown in the amic acid TGA profiles. This imidization and the accompanying aniline elimination begin at about 130°C, under nitrogen, to form the surface alkyl imide which slowly decomposes at 400°C. TGA analysis indicates that the surface-bound imide undergoes minimal degradation under nitrogen at 370 ± 10°C; temperatures above this threshold range produce changes in the APS–imide interface. |
