Stress Measurement Using EBSD Analysis of Grains in Copper Foil

A cyclic biaxial stress measurement method using electrodeposited copper foil was examined. The crystallographic orientations of individual grains that undergo grain growth in copper foil subjected to cyclic loading were analyzed by electron backscatter diffraction (EBSD). One of the slip directions in most of the grains corresponded to the direction of maximum shear stress when the biaxial stress ratio was negative. However, the number of grains with other orientations gradually increased as the biaxial stress ratio approached zero. On the basis of these features, we propose biaxial stress measurement using EBSD analysis of grown grains in copper foil. Our new method has excellent resolution compared with other stress-strain measurement methods since it can measure the average biaxial stress ratios in an area of 500 μm × 500 μm.