多弧离子镀TiN与不同金属基材间的接触界面与表面特性

用多弧离子镀技术在不同金属基材上进行TiN镀膜实验 ,制备了TiN/Fe、TiN/Cu和TiN/Cr/Cu复合膜 .借助扫描电子显微镜 (SEM)、X射线衍射仪 (XRD)和光电子能谱 (XPS) ,研究了TiN与Fe、Cu和Cr/Cu三种不同衬底接触界面的形貌、结构及其表面特性 .SEM观察发现 ,在一定离子镀膜条件下 ,TiN涂层可与Fe、Cu和Cr/Cu金属基材形成均匀平整的接触界面 ,在铜基上TiN界面清晰 ,在Fe与Cr/Cu界面有明显的层状晶界微结晶分布 .XRD分析显示 ,Fe、Cu和Cr/Cu表面生成的薄膜都包含TiN、Ti2 N等多晶相 ,在Cr/Cu界面还包含Ti-Cr的金属间化合物 .XPS结果表明 ,表面除了TiN膜外 ,还生成TiO2 和TiOxNy 等氧化膜 .Ar+ 刻蚀 5min后 ,TiO2 消失 ,TiOxNy 减少 ,TiN则呈增加趋势 .TiN与Cr/Cu界面形成明显的Ti-Cr和Cr-Ni互扩散层 ,这有助于增强薄膜附着力 ,形成较牢固的TiN涂层 .

The Contact Interface and Surface Characters between Multiarc Ion Plating TiN and Different Base Materials

With the technology of multiarc ion plating, the experiments of TiN membrane-plating on the different base materials are carried out, which fabricate TiN/Fe, TiN/Cu and TiN/Cr/Cu compound membranes. The appearances, structures and surface characters of the contact interfaces of TiN and three different underlays, which are Fe, Cu and Cr/Cu, are obtained with the help of the SEM, XRD and XPS. The observation of SEM shows TiN coating and Fe, Cu of Cr/Cu base materials can form the well-distributed and flat contact interface under the certain ion membrane-plating condition. At the same time, there is an apparent interface on the copper material and the obvious distribution of sandwich micro crystallization. The analysis of XRD manifests the membranes shaped on Fe, Cu and Cr/Cu surfaces all contain the heteromorphism such as TiN, Ti 2N and so on. It also demonstrates there are some Ti-Cr metal compounds on the Cr/Cu interface. The result of XPS shows the surface also form TiO 2 and TiO x N y oxidizing membranes besides TiN membrane. After Ar + etching for five minutes, TiO 2 disappears, and TiO x N y decreases while TiN increases. The interface of TiN and Cr/Cu shapes palpable Ti-Cr and Cr-Ni mutual diffused layer which is helpful to enhance the adhesion force of membrane and shape firm TiN coating.