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LED全自动粘片机系统软件结构和控制时序设计
引用本文:侯为萍,周庆亚,高建利,周冉,孟宪俊.LED全自动粘片机系统软件结构和控制时序设计[J].电子工业专用设备,2011,40(2):30-32,37.
作者姓名:侯为萍  周庆亚  高建利  周冉  孟宪俊
作者单位:中国电子科技集团公司第四十五研究所;
摘    要:LED全自动粘片机具有自动化程度高,控制逻辑复杂的特点,介绍了一种高速高精度LED全自动粘片机系统的软件设计方案,通过全面分析系统软件需求,设计了软件结构和控制逻辑,继而成功实现了系统的软件设计,测试证明设备效率高、精度高,运行稳定、可靠.

关 键 词:LED全自动粘片机  软件结构  控制逻辑

Design of the High-speed and High-precision LED Fully-automatic Die Bonder System Software
HOU Weiping,ZHOU Qingya,GAO Jianli,ZHOU Ran,MENG Xianjun.Design of the High-speed and High-precision LED Fully-automatic Die Bonder System Software[J].Equipment for Electronic Products Marufacturing,2011,40(2):30-32,37.
Authors:HOU Weiping  ZHOU Qingya  GAO Jianli  ZHOU Ran  MENG Xianjun
Institution:HOU Weiping,ZHOU Qingya,GAO Jianli,ZHOU Ran,MENG Xianjun(The 45th Research Institute of CECT,Bejing 101601,China)
Abstract:The LED fully-automatic die bonder is characterized by full automation and complicated control algorithms.This paper introduces a design scheme of the high-speed and high-precision LED fully-automatic die bonder system software,the system software is successfully designed by analyzing the software requirement and designing the structure and control logic,the final test has proved that the equipment is high-efficiency,high-precision,and runs steadily and reliably.
Keywords:LED fully-automatic die bonder  Software structure  Control logic  
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