| 湿化学镀SPR金基底及其性能表征 |
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| 引用本文： | 周宥辰,王艳艳,马志方,姜艳霞,邱瑾,孙世刚.湿化学镀SPR金基底及其性能表征[J].电化学,2011,17(1):31. |
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| 作者姓名： | 周宥辰 王艳艳 马志方 姜艳霞 邱瑾 孙世刚 |
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| 作者单位： | 厦门大学化学化工学院化学系固体表面物理化学国家重点实验室; |
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| 基金项目： | 国家自然科学基金(20833005,20873116,60936003); 超分子结构和材料国家重点实验室(SKLSSM200910)资助 |
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| 摘 要： | 建立一种由单一水相操作的表面等离子体共振法(SPR)制备金基底.即:在3-氨基丙基三甲氧基硅烷(APTMS)修饰的玻璃片上自组装一层细小的金胶纳米粒子,以此为催化模板,利用化学镀技术在纳米尺度范围内控制金膜的均匀增长,获得优异SPR信号响应所需要的金膜形貌和厚度.紫外光谱(UV-vis),透射电镜(TEM)观测表明,纳米金膜催化模板粒径约为2.5 nm.扫描电镜(SEM)观察湿化学镀SPR金基底均匀分布,粒径约为40 nm.与商品化真空镀金基底相比,湿化学镀金基底对乙醇的SPR响应强度相当,且可调控性更高.
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| 关 键 词： | 表面等离子体共振光谱(SPR) 湿化学镀法 自制SPR金基底 商业SPR金基底 |
| 收稿时间： | 2011-02-28 |
Prepartion and Characterization of SPR Au Substrate Using Wet Chemical Plating |
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| ZHOU You-chen,WANG Yan-yan,MA Zhi-fang,JIANG Yan-xia,QIU Jin,SUN Shi-gang.Prepartion and Characterization of SPR Au Substrate Using Wet Chemical Plating[J].Electrochemistry,2011,17(1):31. |
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| Authors: | ZHOU You-chen WANG Yan-yan MA Zhi-fang JIANG Yan-xia QIU Jin SUN Shi-gang |
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| Institution: | ZHOU You-chen,WANG Yan-yan,MA Zhi-fang,JIANG Yan-xia,QIU Jin,SUN Shi-gang(Department of Chemistry,College of Chemistry and Chemical Engineering,State Key Lab for Physical Chemistry of Solid Surface,Xiamen University,Xiamen 361005,Fujian,China) |
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| Abstract: | The present study developed a preparation method of SPR gold substrate based on water phase operation.Firstly,on the glass modified by APTMS we self-assembed a gold colloid monolayer as the catalyst bed;Secondly,using the chemical plating technique,we made the gold film increase equably within the namometer range to obtain the proper shape and thinkness of the gold film required by the SPR.The analysis results of UV-vis and TEM demonstrated that the diameter of the monolayer formed from gold nanoparticles w... |
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| Keywords: | surface plasmon resonance(SPR) wet chemical plating homemade SPR Au substrate commercial SPR Au substrate |
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