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The effect of temperature and strain rate on the tensile properties of a Sn99.3Cu0.7(Ni) lead-free solder alloy |
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| Authors: | Fulong Zhu Honghai Zhang Sheng Liu |
| Institution: | a Institute of Microsystems, School of Mechanical Science and Engineering, HuaZhong University of Science and Technology, 1037 Luoyu Road, Wuhan, Hubei Province 430074, PR China b Department of Mechanical Engineering, Wayne State University, Detroit, MI 48202, USA c Institute of Materials Science and Engineering, Henan Polytechnic University, Jiaozuo, Henan Province 454000, PR China |
| Abstract: | In this paper, the effect of temperature and strain rate of the lead-free solder alloy Sn99.3Cu0.7(Ni) was investigated. Tensile properties of this lead-free solder Sn99.3Cu0.7(Ni) at various temperatures and strain rates were determined and compared with those of the typical Pb-containing solder Sn63Pb37. During tensile tests of different temperatures and strain rates, the ultimate tensile strength (UTS) and 0.2% yield stress of the lead-free solder alloy Sn99.3Cu0.7(Ni) decreased with increasing test temperatures and decreasing strain rate. It was noted that mechanical properties of Sn99.3Cu0.3(Ni) showed strong temperature dependence and strain rate sensitivity in the tensile tests of various temperatures and strain rates. Temperature and strain rate impacted rigorously flowing behaviors of the lead-free solder Sn99.3Cu0.7(Ni) in the course of tensile deformation. The microstructure and fracture morphology of the lead-free solder Sn99.3Cu0.7(Ni) were analyzed by scanning electron microscope (SEM). In the SEM micro-graph of the fracture surface of this lead-free solder specimen tested, it was noted that increasing temperature affected the microstructure and morphology of fracture surface. |
| Keywords: | Lead-free Solder Tensile property Work hardening Dynamic recovery Temperature dependence Strain rate sensitivity |
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