| 钎焊陶瓷和金属的钎料作用机理 |
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| 引用本文： | 于文学,安正植,峰岸知弘.钎焊陶瓷和金属的钎料作用机理[J].吉林大学学报(理学版),1996(4). |
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| 作者姓名： | 于文学 安正植 峰岸知弘 |
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| 作者单位： | 吉林大学材料科学系，日本千叶工业大学 |
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| 摘 要： | 对以金属铜和活性金属钛为钎料，钎焊陶瓷Ｓｉ３Ｎ４和纯金属铝时，钎料的作用及分布进行了观察和分析．结果表明，钎焊过程中陶瓷和金属之间的界面上，在陶瓷的热电效应的作用下，产生陶瓷侧为负极的热电动势．活性金属钛偏析到陶瓷侧，形成化合物．
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| 关 键 词： | 钎焊，热电效应，陶瓷，活性金属 |
Effect of Cu and Ti on Si_3N_4-Mo Interface |
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| Yu Wen-cue,An Zhengzhi.Effect of Cu and Ti on Si_3N_4-Mo Interface[J].Journal of Jilin University: Sci Ed,1996(4). |
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| Authors: | Yu Wen-cue An Zhengzhi |
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| Abstract: | This paper analyses the interface between ceramic St3N.and metal Mo with metal Cu and active metal Ti brazing, and describes the action and distribution of Cu and Ti. The results show that because the heat--electroeffect of St,N, ceramic produced heat--electropotential on the interface between St,N. and Mo metal with the negative pole on the side of the ceramic. Active metal Ti segregated to the side of the ceramic forming compounds. |
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| Keywords: | brazing Si_3N_4 ceramic Ti active metal heat-electroeffect |
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