UV resistance of encapsulated low molecular weight aromatic compounds in fluoroalkyl end‐capped trimethoxyvinylsilane oligomer/silica nanocomposites

Sol–gel reactions of fluoroalkyl end‐capped trimethoxyvinylsilane oligomer in the presence of low molecular weight aromatic compounds (ArH) such as 1,1′‐bi(2‐naphthol) (BINOL) and 2‐hydroxy‐4‐methoxy benzophenone (HMB) were found to proceed smoothly under alkaline conditions at room temperature to give the corresponding fluorinated oligomeric silica nanocomposites‐encapsulated aromatic compounds (BINOL and HMB) [R_F‐(VM‐SiO₂)_n‐R_F/ArH nanocomposites]. UV light irradiation (λ_max: 254 nm) toward R_F‐(VM‐SiO₂)_n‐R_F/ArH nanocomposites showed that photodegradation of encapsulated ArH was not observed at all in the fluorinated nanocomposites cores, although the parent ArH can exhibit an effective photodegradation behavior under similar conditions. Especially, encapsulated ArH can exhibit no weight loss corresponding to the contents of the aromatic compounds in the fluorinated nanocomposites even after calcination at 800°C. Therefore, fluoroalkyl end‐capped trimethoxyvinylsilane oligomer has high potential for not only the thermal resistance but also the UV resistance fluorinated polymeric materials. Copyright © 2014 John Wiley & Sons, Ltd.