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An optimized preparation of bismaleimide–diamine co‐polymer matrices
Authors:Coswald S. Sipaut  Vejayakumaran Padavettan  Ismail Ab. Rahman  Rachel F. Mansa  Jedol Dayou  Mohammad Jafarzadeh
Affiliation:1. Energy and Material Research Group, School of Engineering and Information Technology, Universiti Malaysia Sabah, , 88400 Kota Kinabalu, Sabah, Malaysia;2. School of Chemical Sciences, Universiti Sains Malaysia, , 11800 Penang, Malaysia;3. School of Dental Sciences, Health Campus, Universiti Sains Malaysia, , 16150 Kubang Kerian, Kelantan, Malaysia;4. Energy, Vibration and Sound Research Group (e‐VIBS), School of Science and Technology, Universiti Malaysia Sabah, , 88400 Kota Kinabalu, Sabah, Malaysia
Abstract:The main aim of this study was to develop an improved method for the preparation of a bismaleimide–diamine (BMI/DDM) polymer matrix, achieving shorter curing time, longer processing time (pot life), and good thermal mechanical properties. A matrix of BMI/DDM thermoset was prepared at optimal conditions and formulation, containing BMI and DDM in a 2:1 mol ratio with 0.1 wt% of dicumyl peroxide (DCP) as the curing accelerator. An optimal temperature of 150°C was selected for both melt‐mixing and curing processes. The mechanism of matrix preparation was also investigated using differential scanning calorimetry and quantitative Fourier transformed infrared analysis. DCP at the optimal concentration was found to accelerate cross‐linking reactions between BMI and DDM without inhibiting the chain‐extension reaction of BMI. The specified formulation exhibited longer gel time (208 s/g) and shorter post‐curing time (2 h) compared to other formulations. In addition, thermomechanical behavior and thermal stability were analyzed by dynamic mechanical analysis and thermomechanical analysis, and thermogravimetric analysis, respectively. The storage modulus (E′), glass transition temperature (Tg), and decomposition temperature (Td) of the BMI/DDM thermosets increased with the BMI content of the formulations, while the coefficient of thermal expansion and damping behavior (tan δ) decreased in a similar manner, primarily because of an increase in the degree of cross‐linking. Copyright © 2014 John Wiley & Sons, Ltd.
Keywords:bismaleimide  diamine  thermal expansion  thermoset  composite
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