A novel approach to thermal Analysis of Thin films

A novel instrument is described called the Thin film Analyser (TFA) which quantitatively measures changes in mechanical and rheological properties of drying films in-situ on a test panel. It is based around a simple force-sensing device, capable of carrying various probes, which can be positioned in anX-Y plane over the panel. Temperature control is achieved by means of a heating block under the sample. By imposing a thermal gradient along the block, measurements can be obtained at a series of temperatures in a single experiment. Several applications of the TFA to the drying of curable and latex-based coatings are discussed, as well as some more specialized uses. The TFA concept represents a novel approach to the thermal analysis of thin films.The authors gratefully acknowledge the design, engineering and software development work of the Instrument Group at ICI Paints, in particular John Hayton, Neil Burrows, Tony Evans and Ian Francis, who have now built three versions of the TFA.