Infrared-light interferometry and a phase-stepping algorithm for measuring the three-dimensional topography of components covered with GaAs or Si |
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Authors: | Xiujian Chou Kangkang Niu Yi Liu Chenyang Xue Jun Liu Wendong Zhang |
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Institution: | 1. Key Laboratory of Instrumentation Science and Dynamic Measurement, North University of China, Ministry of Education National Key Laboratory of Science and Technology on Electronic Test and Measurement, Xueyuan Road 3, Taiyuan, Shanxi Province, 030051, China
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Abstract: | White-light scanning interferometry is extended from the visible-light region to the infrared-light region to measure the
three-dimensional (3D) topography of components. An infrared-light interference system based on a linnik-type interferometric
microscope is developed according to the principle of transmission of semiconductor materials in the infrared-light region.
The 3D topography is measured using the components covered with a Si or GaAs wafer based on a phase-stepping algorithm. The
3D topography can be obtained accurately and relative step heights can be determined within an error less than 3% compared
with the instrument MSA 400, a well-known commercially available apparatus used in the field of 3D topography measurement. |
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