电子浆料用超微细玻璃粉的等离子体改性

以六甲基二硅氧烷为单体,利用高频等离子体在超微细低熔磷酸盐玻璃粉体表面聚合硅氧聚合物包覆薄膜。用水和粉体压片之间的接触角变化表征了等离子体工艺参数对粉体表面能的影响。结果表明改性后粉体配制电子浆料的细度、黏度、流变特性提高显著。改性后可以改变或控制超微细粉体的表面能大小,从而可调节电子浆料的流变性和印刷适性。

Plasma Surface Modification of Ultra-fine Glass Powder for Electronic Paste

A thin silicon oxide encapsulation film was coated on the surface of ultra-fine phosphate glass particles for electronic paste by high frequency plasma polymerization of hexamethyldisiloxanc. The influence of surface energy of glass particles from plasma treatment was characterized by the contact angle measurement of the powder particle pellet. The comparison of the fineness, viscosity and rheological property of between the electronic pastes prepared respectively by the plasma treated and untreated glass powders showed a significant difference. The dispersion of glass ultra-fine powder in the organic vehicle of ethyl cellulose terpineol solution are improved significantly. Also, the results show that, the surface energy of glass ultra-fine powder can be modified controllablely by plasma polymerizing a thin encapsulation film of silicon oxide. Hence, the rheological property and the printability of the electrical paste on different substrates may be tailored by the plasma modification method.