Superposition and Destructive Residual Stress Measurements

The paper describes destructive measurement of residual stress profiles across two perpendicular planes in a single coupon. Several established destructive measurement techniques can determine the residual stress locked in a coupon of interest, but in general, only a single measurement can be taken without releasing stress and affecting subsequent measurements. However, when the first measurement determines a stress profile across an entire plane, the released stress can be determined, through a supplemental stress analysis incorporating results from the first measurement, and then accounted for in a subsequent measurement. To demonstrate the capability, we describe measurements of residual stress profiles across two perpendicular planes in aluminum compact tension coupons. Residual stress was introduced into the coupons by laser shock peening, and measurements were performed using the slitting method. For each coupon, the measured stress profile on the first plane was used to compute stress released on the second plane. By adding this released stress to measured stress for the second plane, we obtain a stress profile for the second plane in the original configuration. Results of a numerical model that predicts residual stress due to laser shock peening are presented, and agreement between the model and experimental results gives confidence in the superposition method applied.