Electrodeposition of Copper in Presence of Carbohydrates

The rates of electrodeposition of copper plates were determined by measuring cathodic limiting current in the absence and in the presence of carbohydrates (glucose, fructose, mannose, sucrose, lactose, and maltose). It is found that the rate of electrodeposition decreases in the presence of organic additives by an amount ranging from 1.89% to 35.85%, and depending on the types of additives and its concentrations. Our investigation of adsorption isotherm indicates that the inhibition fits both the Langmuir adsorption isotherm and Flory-Huggins adsorption isotherm; we found that the rate of electrodeposition decreases by increasing height and increasing CuSO₄ concentrations. Thermodynamic parameters are given and show that electrodeposition process is diffusion controlled. The rate of deposition and its equations are represented:

• Sh = 0.099Re^0.715 Sc^0.33 for glucose with average deviation: ±0.158%

• Sh = 0.097Re^0.715 Sc^0.33 for fructose with average deviation: ±0.058%

• Sh = 0.099Re^0.715 Sc^0.33 for mannose with average deviation: ±0.108%

• Sh = 0.098Re^0.713 Sc^0.33 for sucrose with average deviation: ±0.003%

• Sh = 0.099Re^0.714 Sc^0.33 for lactose with average deviation: ±0.018%

• Sh = 0.099Re^0.713 Sc^0.33 for maltose with average deviation: ±0.097%.