Meltable phenylethynyl-capped oligoimide resins derived from 1,4-bis(4-amino-2-trifluoromethylphenoxy)benzene and 3,4′-oxydianiline

A series of meltable oligoimide resins with controlled molecular weights by reactive phenylethynyl endcapping groups have been prepared by the thermal polycondensation of 3,3′,4,4′-biphenyltetracarboxylic dianhydride (s-BPDA) with the aromatic diamine mixtures consisting of different mole ratios of 1,4-bis(4-amino-2-trifluoromethylphenoxy)benzene (1,4,4-6FAPB) and 3,4′-oxydianiline (3,4′-ODA) in the presence of 4-phenylethynylphthalic anhydride (PEPA) as molecular weight-controlling and reactive endcapping reagent. Experimental results indicated that the molecular weight-controlled oligoimide resins were mixtures containing a series of biphenylethynyl-endcapped oligoimides with different chemical structures and different molecular weights. The typical oligoimide resins could be melted at temperatures of 300 °C to yield stable molten fluid with melt viscosity of 13.4 Pa s, which was suitable for melt processing. The molten oligoimide resins could be further polymer chain extended and crosslinked by thermal curing of the reactive phenylethynyl groups to give strong and tough thermosetted polyimides. Thus, the oligoimide resin with calculated molecular weight of 2500 exhibited not only good meltability with low melt viscosity, but also high melt stability and fluidability at temperatures of <300 °C. After thermal curing, the obtained thermosetted polyimide showed high glass transition temperature (>316 °C, DMA), excellent thermal stability with initial thermal decomposition temperature of 588 °C and good mechanical properties with flexural strength of 159.1 MPa, flexural moduli of 3.3 GPa, tensile strength of 94.7 MPa and elongation at breakage of 9.0%.