Poly(1,3,4-oxadiazole-imide)s containing dimethylsilane groups

New poly(1,3,4-oxadiazole-imide)s containing dimethylsilane units have been prepared by solution polycondensation reaction of an aromatic dianhydride incorporating dimethylsilane group, namely bis(3,4-dicarboxyphenyl)dimethylsilane dianhydride, with different aromatic diamines having preformed 1,3,4-oxadiazole ring, such as 2,5-bis(p-aminophenyl)-1,3,4-oxadiazole, 2,5-bis[p-(4-aminophenoxy)phenyl]-1,3,4-oxadiazole, 2,5-bis[p-(3-aminophenoxy)phenyl]-1,3,4-oxadiazole, 2-(4-fluorophenyl)-5-(3,5-diaminophenyl)-1,3,4-oxadiazole, and 2-(4-dimethylaminophenyl)-5-(3,5-diaminophenyl)-1,3,4-oxadiazole. The polymers were easily soluble in polar organic solvents, such as N-methylpyrrolidinone, N,N-dimethylformamide, and pyridine, as well as in less polar organic solvents, such as tetrahydrofuran and chloroform. Very thin coatings deposited on silicon wafers exhibited smooth, pinhole-free surface in atomic force microscopy investigations. The polymers showed high thermal stability with decomposition temperature being above 415 °C.They exhibited a glass transition in the temperature range of 202-282 °C, with reasonable interval between glass transition and decomposition temperature. Solutions of the polymers in N,N-dimethylformamide exhibited fluorescence, having maximum emission wavelength in the range of 353-428 nm.