| 高温功率半导体器件连接的低温烧结技术 |
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| 引用本文： | 陈旭,李凤琴,蔺永诚,陆国权.高温功率半导体器件连接的低温烧结技术[J].电子元件与材料,2006,25(8):4-6. |
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| 作者姓名： | 陈旭 李凤琴 蔺永诚 陆国权 |
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| 作者单位： | 天津大学化工学院,天津,300072;美国弗吉尼亚理工大学材料科学与工程系,VA,24061 |
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| 基金项目： | 国家重点基础研究发展计划(973计划);高等学校学科创新引智计划资助项目 |
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| 摘 要： | 综述了功率电子器件和模块的连接和封装工艺,介绍了粉末致密烧结技术和用于电子封装的现状,对纳米银金属焊膏烧结技术进行了讨论。研究表明,纳米银可有效降低烧结温度,提高设备的高温稳定性、导热性、导电性、机械强度、抗疲劳性等。由于银的熔点较高,这种新技术可应用于高温功率器件的封装。
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| 关 键 词： | 电子技术 功率半导体 综述 电子封装 纳米银焊膏 烧结 |
| 文章编号： | 1001-2028（2006）08-0004-03 |
| 收稿时间： | 2006-04-12 |
| 修稿时间： | 2006年4月12日 |
Low-temperature Sintering Technique for High-temperature Power Semiconductor Devices Packaging |
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| CHEN Xu,LI Feng-qin,LIN Yong-cheng,LU Guo-quan.Low-temperature Sintering Technique for High-temperature Power Semiconductor Devices Packaging[J].Electronic Components & Materials,2006,25(8):4-6. |
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| Authors: | CHEN Xu LI Feng-qin LIN Yong-cheng LU Guo-quan |
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| Institution: | 1. School of Chemical Engineering and Technology, Tianjin University, Tianjin 300072, China; 2. Materials Science and Engineering Department, Virginia Tech, Blacksburg, VA 24061, USA |
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| Abstract: | The interconnection and packaging of power semiconductor devices and modules were summarized. Sintering of powder compacts and the present status of electronic packaging were introduced. The sintering technique of nano-silver paste was also discussed. The results show that nanoscale silver powder is viable to lower the sintering temperature, improve the high-temperature stability, thermal conductivity, electrical conductivity, mechanical strength of device and resist to fatigue failure of the device, This novel technique is also suitable for high temperature power device packaging due to the high melting temperature of silver. |
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| Keywords: | electronic technology power semiconductor review electronic packaging nanosilver paste sintering |
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