| 化学亚胺化程度对正性光敏聚酰亚胺影响 |
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| 引用本文： | 朱丹阳,金锐,吴作林,韩宝春,杨正华,张春华. 化学亚胺化程度对正性光敏聚酰亚胺影响[J]. 应用化学, 2017, 34(3): 276-281. DOI: 10.11944/j.issn.1000-0518.2017.03.160195 |
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| 作者姓名： | 朱丹阳 金锐 吴作林 韩宝春 杨正华 张春华 |
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| 作者单位： | 中国科学院长春应用化学研究所,高分子复合材料工程实验室 长春 130022;全球能源互联网研究院 北京 102211 |
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| 基金项目： | 国家电网公司科技项目:高压IGBT芯片表面钝化工艺研究(5455DW150005) |
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| 摘 要： | 选用2,2′-双三氟甲基-4,4′-联苯二胺(TFDB)与二苯醚四甲酸二酐(ODPA)作为聚合物的基本骨架进行缩聚反应生成聚酰胺酸,再经过化学亚胺化得到可溶性聚酰亚胺(PI)。通过调节2-甲基吡啶在亚胺化试剂中的含量以达到控制酰亚胺化程度的目的,探讨不同亚胺化程度的PI胶的显影性能。结果表明,当n(2-甲基吡啶)∶n(乙酸酐)=1∶5时,所合成的光敏聚酰亚胺的显影性能最优。
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| 关 键 词： | 正性光敏聚酰亚胺 化学亚胺化 溶解性 光刻 |
| 收稿时间： | 2016-05-11 |
Effect of the Degree of Chemical Imidization on the Positive Photosensitive Polyimide |
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| ZHU Danyang,JIN Rui,WU Zuolin,HAN Baochun,YANG Zhenghua,ZHANG Chunhua. Effect of the Degree of Chemical Imidization on the Positive Photosensitive Polyimide[J]. Chinese Journal of Applied Chemistry, 2017, 34(3): 276-281. DOI: 10.11944/j.issn.1000-0518.2017.03.160195 |
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| Authors: | ZHU Danyang JIN Rui WU Zuolin HAN Baochun YANG Zhenghua ZHANG Chunhua |
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| Affiliation: | Polymer Composites Engineering Laboratory,Changchun Institute of Applied Chemistry Chinese Academy of Sciences,Changchun 130022,China;Global Energy Interconnection Research Institue,Beijing 102211,China |
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| Abstract: | Condensation polymerization of 2,2'-bis(trifluoromethyl)-4,4'-diamino biphenyl(TFDB) and 3,3',4,4'-tetracarboxydiphthalic ether dianhydride(ODPA) gives a soluble polyimide. The effect of the degree of chemical imidization on positive photosensitive polyimide performance was investigated by adjusting the content of α-picoline in the imidization reagent to control the extent of the imide. The results show that the photosensitive polyimide has the best developing performance when the mole ratio of α-picoline to acetic anhydride is 1 to 5 in the process of chemical imidization. |
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| Keywords: | positive photosensitive polyimide chemical imidization solubility photolithography |
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