生物凝胶电镀法制备铜纳米多孔膜

采用生物凝胶电镀法制备铜纳米多孔膜。 电镀电压为5 V,阳极为铜片,实验探究了电镀液成分、电镀时间、阴极衬底及沉积电压对电镀层表面形貌的影响。 采用扫描电子显微镜(SEM)和X射线衍射(XRD)对样品形貌和晶型进行表征,得出制备铜膜的最佳条件。 结果表明,电镀的铜膜颗粒尺寸在100 nm左右,晶粒平均尺寸为25 nm,存在较强的(111)织构,而且XRD结果表明,附着的壳聚糖凝胶对铜膜有保护作用,防止其被氧化。 同时采用电化学工作站对其过程中的电镀电流进行实时测量,电流变化曲线表明电镀进行到一定时间后,电流趋于一个很小的稳定值,壳聚糖凝胶阻止了镀液中铜离子的进一步沉积。

Preparation of Nano-porous Copper Film with Bio-gel Plating

Nano-porous copper film was prepared by sol-gel electroplating. Using copper sheet as anode, the effects of the plating solution composition, plating time, cathode substrate and plating voltage on the morphology of the plating layer were investigated in the plating voltage at 5 V. Scanning electron microscopy and X-ray diffraction methods were utilized to analyze the morphology and crystal forms to obtain the optimum conditions for preparing the copper films. The particle size of the copper film is about 100 nm, grain size is about 25 nm, and an enhanced (111) texture exists in the cooper film. XRD analysis depicts that the attached chitosan gel protects the copper film from being oxidized. The plating current tends to be stable at a low value after a certain time of plating. Chitosan gel prevents further deposition of copper ions in the bath on the substrate.