含芳基噻唑基团环氧树脂材料的制备及热性能

制备了一种含芳基噻唑基团热稳定环氧树脂材料(TDABZ),通过傅里叶变换红外光谱(FTIR)对其结构进行了表征,采用热重分析-微熵热重分析(TGA-DTG)计算了TDABZ的热分解动力学参数,利用热重分析(TGA)和动态热机械分析(DMTA)探讨了TDABZ的耐热性能。 结果表明,TDABZ通过TGDDM结构中的环氧基团与混合固化剂(DDS和2-ABZ)结构中的活泼氢反应,在较低的温度下就能完全交联固化。 通过Kissinger和Ozawa方法求得TDABZ的热分解活化能分别为205.5和221.9 kJ/mol。 TDABZ固化物具有优异的耐热性能,双悬臂梁法测得的玻璃化转变温度(T_g)达到242.3 ℃,在N₂气气氛下失重5%对应的温度(T_d5)为340.2 ℃,最大失重速率对应的温度(T_dmax)为395.5 ℃,600 ℃的质量保留率为24.1%,显著提高了环氧树脂的热稳定性能,拓宽了其应用领域。

Preparation and Thermal Property of Epoxy Resin Containing Aromatic Thiazole Groups

A kind of thermally stable epoxy resin containing aromatic thiazole groups(TDABZ) was prepared. The structure of TDABZ was characterized by Fourier transform infrared spectra(FTIR), and the thermal degradation kinetics parameters were determined by thermogravimetric analysis-derivative thermogravimetry(TGA-DTG). The thermal stability of the cured resin was studied by thermogravimetric analysis(TGA) and dynamic thermomechanical analysis(DMTA). TDABZ was completely cured under controled condition by the reaction between epoxy group and the active nitrogen in DDS/2-ABZ. The activation energy value calculated by the Kissinger's and Ozawa's methods is 205.5 kJ/mol and 221.9 kJ/mol, respectively. The cured TDABZ exhibits excellent thermal stability with the glass transition temperature(T_g) of 242.3 ℃, the temperature of 5% mass loss(T_d5) and the temperature at maximum mass loss rate(T_dmax) are 242.3 ℃ and 395.5 ℃, respectively, and the residue at 600 ℃ is up to 24.1%, which can improve the thermal stability of epoxy resin, and broaden its applications.