| ULSI化学机械抛光的研究与展望 |
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| 引用本文： | 张楷亮,宋志棠,封松林,CHEN Bomy.ULSI化学机械抛光的研究与展望[J].微电子学,2005,35(3):226-230. |
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| 作者姓名： | 张楷亮 宋志棠 封松林 CHEN Bomy |
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| 作者单位： | 中国科学院,上海微系统与信息技术研究所,半导体功能薄膜工程与技术研究中心,上海,200050 |
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| 基金项目： | 国家高技术研究发展(863)计划资助项目(2003AA302720,2004AA302G20)，上海市纳米科技与产业发展促进中心纳米专项(0352nm016,0452nm012)基金资助项目 |
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| 摘 要： | 随着半导体行业的飞速发展，集成电路特征尺寸的微细化，半导体薄膜表面的高平坦化对器件高性能、低成本、高成品率有着重要的影响。作为唯一能实现全局平坦化方法的化学机械抛光(CMP)，近年来发展迅速，应用广泛。文章综述了化学机械抛光技术的发展现状：包括化学机械抛光设备、抛光液、抛光机理模型及应用研究进展；在此基础上，对CMP下一步发展的方向及其应用前景进行了展望。
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| 关 键 词： | 化学机械抛光 平坦化 薄膜 特大规模集成电路 抛光液 |
| 文章编号： | 1004-3365(2005)03-0226-05 |
Research and Prospects of Chemical Mechanical Polishing for ULSI |
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| ZHANG Kai-liang,SONG Zhi-Tang,FENG Song-lin,CHEN Bomy.Research and Prospects of Chemical Mechanical Polishing for ULSI[J].Microelectronics,2005,35(3):226-230. |
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| Authors: | ZHANG Kai-liang SONG Zhi-Tang FENG Song-lin CHEN Bomy |
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| Abstract: | With the rapid development of semiconductor industry and ever shrinking feature size in ULSI's,the planarization of semiconductor thin films becomes more and more important for high performance,low cost and high yield devices.As a unique global planarization method,chemical mechanical polishing (CMP),which has been developed at a fast pace,finds wide applications in ULSI's in recent years.The development of CMP machines,consumables, and polishing mechanism are reviewed.The future trend of the technology and its application prospect are discussed. |
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| Keywords: | Chemical mechanical polishing Planarization Thin film ULSI Slurry |
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