Microscale mechanics for metal thin film delamination along ceramic substrates |
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Authors: | WEI Yueguang |
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Institution: | LNM,Institute of Mechanics,Chinese Academy of Sciences,Beijing 100080,China |
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Abstract: | The metal thin film delamination along metal/ceramic interface in the case of large scale yielding is studied by employing
the strain gradient plasticity theory and the material microscale effects are considered. Two different fracture process models
are used in this study to describe the nonlinear delamination phenomena for metal thin films. A set of experiments have been
done on the mechanism of copper films delaminating from silica substrates, based on which the peak interface separation stress
and the micro-length scale of material, as well as the dislocation-free zone size are predicted. |
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Keywords: | metal thin film nonlinear delamination microscale mechanics |
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