GaN HEMT栅边缘电容用于缺陷的研究

本文对GaN HEMT栅漏电容的频率色散特性进行分析,认为栅边缘电容的色散是导致栅漏电容频率色散特性不同于圆肖特基二极管电容的主要原因. 通过对不同栅偏置条件下缺陷附加电容与频率关系的拟合,发现小栅压下的缺陷附加电容仅满足单能级缺陷模型,而强反向栅压下的缺陷附加电容同时满足单能级和连续能级缺陷模型. 实验中栅边缘电容的频率色散现象在钝化工艺后出现,其反映的缺陷很可能是钝化工艺引入,且位于源漏间栅金属未覆盖区域的表面. 最后通过低频噪声技术进一步验证栅边缘电容提取缺陷参数的可行性. 低频噪声技术获得的单能级 关键词： HEMT 边缘电容 缺陷 低频噪声

Investigation on trap by the gate fringecapacitance in GaN HEMT

The analysis of the frequency dispersion characteristics of the gate-drain capacitance of GaN HEMT indicates that the gate fringe capacitance is responsible for the dispersion difference between the gate-drain capacitance and circle Schottky diode. By fitting the relationship between the additional capacitance of trap and frequency, we discover that the additional capacitance of trap can meet single energy level model only under small gate bias, and meet both single and consecutive energy level model under strong reverse gate bias. The gate fringe capacitance dispersion appears after SiN passivation. It suggests that the trap observed by fringe capacitance is introduced by passivation, which lies in the surface of the ungated region between source and drain. Finally, the low frequency noise technology is used to validate the feasibility of abstracting trap parameter by the gate fringe capacitance. The time constant of single energy level trap obtained by low frequency noise technology is consistent with the result obtained by the gate fringe capacitance under strong reverse gate bias.