| Abstract: | We have adapted a “peel-off” process to structure stacked organic semiconductors (conducting polymers or small molecules) and metal layers for diode microfabrication. The fabricated devices are organic diode rectifier in a coplanar waveguide structure. Unlike conventional lithographic process, this technique does not lead to destroy organic active layers since it does not involve harsh developer or any non-orthogonal solvent that alter the functionality of subsequentially deposited materials.This process also involves recently reported materials, as a p-dopant of an organometallic electron-acceptor Copper (II) trifluoromethanesulfonate, that play the role of hole injection layer in order to enhance the performances of the diode.Comparatively to self-assembled monolayers based optimized structures, the fabricated diodes show higher reproducibility and stability. High rectification ratio for realized pentacene and poly (3-hexylthiophene) diodes up to 106 has been achieved. Their high frequency response has been evaluated by performing theoretical simulations. The results predict operating frequencies of 200 MHz and 50 MHz for pentacene and P3HT diode rectifiers respectively, with an input oscillating voltage of 2 V peak-to-peak, promising for RFID device applications or for GSM band energy harvesting in low-cost IoT objects. |
