Synthesis and characterization of photo‐crosslinkable poly(amic acid ester)s with 2‐hydroxy‐4‐oxo‐hept‐5‐enyl side chain

Photosensitive poly(amic acid ester)s (PAEs) with 2‐hydroxy‐4‐oxo‐hept‐5‐enyl side group were simply synthesized from a non‐photosensitive polyamic acid (PAA), which was prepared from cyclobutane‐1,2,3,4‐tetracarboxylic dianhydride (CBDA) and 4,4′‐diaminodiphenyl ether (DDE) in N‐methyl‐2‐pyrrolidinone (NMP). 1‐oxiranyl‐pent‐3‐en‐2‐one was added to the poly(amic acid) solution to give the photosensitive PAEs by a ring opening esterification of the poly(amic acid). The esterification reaction was conducted with changing a reaction time and amounts of 1‐oxiranyl‐pent‐3‐en‐2‐one. The degree of esterification (DOE) increased with increasing esterification reaction time and amounts of 1‐oxiranyl‐pent‐3‐en‐2‐one. A photo‐lithography evaluation for the PAE‐D4 with the highest DOE was conducted in the presence of 1‐4‐(phenylthio)phenyl]‐2‐(O‐benzoyloxime)‐1,2‐octanedione (PPBO) as a photoinitiator at a wavelength of 365 nm using a high‐pressure mercury lamp. The normalized film thicknesses for PAE‐D3 were measured with various post‐exposure baking (PEB) temperatures, which showed that the optimum PEB temperature was 120°C. The resolution of the resulting polyimide film cured at 250°C for 60 min was 25 µm. The initial decomposition temperature of the polyimide film was around 354°C and there was no weight loss at the temperature of 250–350°C. Copyright © 2009 John Wiley & Sons, Ltd.