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一种 C 频段高集成多功能综合母板设计
引用本文:许 锐 韦学科 李树良. 一种 C 频段高集成多功能综合母板设计[J]. 微波学报, 2024, 0(3): 73-78
作者姓名:许 锐 韦学科 李树良
作者单位:南京电子技术研究所,南京 210039
摘    要:介绍了一种 64 通道的 C 频段高集成多功能综合母板的设计方案和关键技术,该综合母板应用于有源相控阵雷达天线阵面前端模拟子阵。 利用多层印制板压合技术,在天线口径内将电源模块、波控模块和片式 T / R 组件集成在子阵综合母板上。 对各功能网络性能进行了仿真设计、电磁兼容性设计等,最终完成了综合母板设计。 所介绍的 64 通道 C 频段综合母板尺寸为 228 mm×308 mm×4. 8 mm,实测无源射频网络通道幅相一致性优于±0. 1 dB、±1°,有源接收链路通道幅相一致性优于±1. 4 dB、±5°。 该综合母板通过积木化拼接可实现雷达阵面规模二维扩展,适用于多种布局方案,避免了低效重复设计。

关 键 词:高集成  多功能  积木化  综合母板

Design of a C-band Highly Integrated Multi-functional Motherboard
XU Rui,WEI Xueke,LI Shuliang. Design of a C-band Highly Integrated Multi-functional Motherboard[J]. Journal of Microwaves, 2024, 0(3): 73-78
Authors:XU Rui  WEI Xueke  LI Shuliang
Affiliation:Nanjing Research Institute of Electronics Technology,  Nanjing 210039, China
Abstract:The design scheme and critical technology of a 64 channel C-band high integration multi-functional motherboard are introduced in this paper. This integrated motherboard is applied to the front end simulation sub-array of active phased array radar. The power module, wave control module and chip T/ R component are integrated into the sub-array motherboard by using the multi-layer printed board pressing technology. Through the simulation design of each function network performance and electromagnetic compatibility design, finally the integrated motherboard design are completed. The dimensions of the 64 channel C-band mother-board are 228 mm×308 mm×4. 8 mm, the amplitude and phase consistency of the measured passive radio network channel is better than ±0. 1 dB, ±1°, and the amplitude and phase consistency of the active receiving link channel is better than ±1. 4 dB, ±5°. The integrated motherboard can realize the two-dimensional expansion of radar array size through block splicing. It is suitable for multiple layout schemes to avoid inefficient and repetitive design.
Keywords:high integration   multi-function   building block   motherboard
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