Prototype of Low Thermal Expansion Materials: Fabrication of Mesoporous Silica/Polymer Composites with Densely Filled Polymer inside Mesopore Space

A prototype of novel low thermal expansion materials using mesoporous silica particles is demonstrated. Mesoporous silica/polymer composites with densely filled polymer inside the mesopore space are fabricated by mechanically mixing both organically modified mesoporous silica and epoxy polymer. The mesopores are easily penetrated by polymers as a result of the capillary force during the mechanical composite processing. Furthermore, we propose a new model of polymer mobility restriction using mesoporous silica with a large pore space. The robust inorganic frameworks covering the polymer effectively restrict the polymer mobility against thermal energy. As a result, the degree of total thermal expansion of the composites is drastically decreased. From the mass‐normalized thermal mechanical analysis (TMA) charts of various composites with different amounts of mesoporous silica particles, it is observed that the coefficient of thermal expansion (CTE) values gradually increase with an increase of the polymer amount outside the mesopores. It is proven that the CTE values in the range over the glass‐transition temperatures (T_g) are perfectly proportional to the outside polymer amounts. Importantly, the Y‐intercept of the relation equation obtained by a least‐square method is the CTE value and is almost zero. This means that thermal expansion does not occur if no polymers are outside the mesopores. Through such a quantative discussion, we clarify that only the outside polymer affects the thermal expansion of the composites, that is, the embedded polymers inside the mesopores do not expand at all during the thermal treatment.