首页 | 本学科首页   官方微博 | 高级检索  
     

改性羟基磷灰石晶须牙科复合树脂材料的制备及研究
引用本文:雷云,黄洁,刘金坤,颜廷亭,陈庆华. 改性羟基磷灰石晶须牙科复合树脂材料的制备及研究[J]. 人工晶体学报, 2017, 46(3): 422-426
作者姓名:雷云  黄洁  刘金坤  颜廷亭  陈庆华
作者单位:昆明理工大学材料科学与工程学院,昆明,650500
基金项目:国家自然科学基金(31260228),云南省自然科学基金国际合作项目(2011IA008)
摘    要:采用硅胶对制备的HAP晶须进行表面改性形成SiO2颗粒附着,然后以硅胶改性的HAP晶须为填料混合甲基丙烯酸酯制备复合树脂材料.二氧化硅对晶须改性是通过形成凝胶颗粒与晶须结合并通过热处理形成牢固的结合.通过XRD、FT-IR光谱和SEM以表征微结构、键性质以及表面相组成.结果表明:经硅胶改性的HAP晶须表面有SiO2小颗粒附着,随着煅烧温度的增加,SiO2颗粒的数量明显增多,尺寸有变大的趋势.复合树脂材料的弯曲强度随改性晶须煅烧温度的增加而增加,以600 ℃煅烧的改性晶须为原料制备的树脂样品,其弯曲强度最高,达到89.46 MPa.

关 键 词:树脂基复合材料  羟基磷灰石晶须  SiO2改性  抗弯强度,

Preparation of Dental Resin Based Composites by Surface Modified Hydroxyapatite Whisker
LEI Yun,HUANG Jie,LIU Jin-kun,YAN Ting-ting,CHEN Qing-hua. Preparation of Dental Resin Based Composites by Surface Modified Hydroxyapatite Whisker[J]. Journal of Synthetic Crystals, 2017, 46(3): 422-426
Authors:LEI Yun  HUANG Jie  LIU Jin-kun  YAN Ting-ting  CHEN Qing-hua
Abstract:HAP whiskers were prepared and surface modified via silicon Sol which formed SiO2 particles on the whisker , then the surface modified HAP whiskers were mixed into methacrylate ester to prepare resin composite.Silica modification relied on the silica sol which forms droplets of gel combined with whisker on the surfaces and forming a strong bond via heat treatment.XRD patterns, FT-IR spectroscopy and SEM were applied in order to character the micro-structure and bond nature as well as the surface phase composition.It is shown that SiO2 particles adhered on the surfaces of HAP whiskers, raising the calcination temperature significantly increased the amounts of SiO2 particles as well as the particle size.The bending strength of the resin material is increased following the raising of calcining temperature treated on modified whiskers.The resin sample prepared by the raw material of HAP whiskers calcined at 600 ℃obtained the highest bending strength, which measured 89.46 MPa.
Keywords:resin-based composites  hydroxyapatite whisker  SiO2 modified  bending strength
本文献已被 万方数据 等数据库收录!
点击此处可从《人工晶体学报》浏览原始摘要信息
点击此处可从《人工晶体学报》下载免费的PDF全文
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号