An anti-plane propagating crack in a functionally graded piezoelectric strip bonded to a homogeneous piezoelectric strip |
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Authors: | S. M. Kwon and K. Y. Lee |
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Affiliation: | (1) Department of Mechanical Design & Manufacturing Engineering, Changwon National University, 9 Sarim-Dong, Changwon, Kyongnam, 641-773, Korea;(2) Department of Mechanical Engineering, Yonsei University, Seoul, 120-149, Korea |
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Abstract: | Summary A finite crack propagating at constant speed in a functionally graded piezoelectric strip (FGPS) bonded to a homogeneous piezoelectric strip is considered. It is assumed that the electroelastic material properties of the FGPS vary exponentially across the thickness of the strip, and that the bimaterial strip is under combined anti-plane mechanical shear and in-plane electrical loads. The analysis is conducted for the electrically unified crack boundary condition, which includes both the traditional permeable and the impermeable ones. By using the Fourier transform, the problem is reduced to the solution of Fredholm integral equations of the second kind. Numerical results for the stress intensity factor and the crack sliding displacement are presented to show the influences of the crack propagation speed, electric loads, FGPS gradation, crack length, electromechanical coupling coefficient, properties of the bonded homogeneous piezoelectric strip and crack location. |
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Keywords: | Functionally graded piezoelectric material Unified crack condition Propagating crack Intensity factor Crack sliding displacement |
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