首页 | 本学科首页   官方微博 | 高级检索  
     检索      


On constructing the analytical solutions for localizations in a slender cylinder composed of an incompressible hyperelastic material
Authors:Hui-Hui Dai  Yanhong Hao  Zhen Chen
Institution:1. Department of Mathematics and Liu Bie Ju Centre for Mathematical Sciences, City University of Hong Kong, 83 TatChee Avenue, Kowloon Tong, Hong Kong;2. Department of Mathematics, City University of Hong Kong, 83 TatChee Avenue, Kowloon Tong, Hong Kong;3. Department of Civil and Environmental Engineering, University of Missouri-Columbia, Columbia, MO 65211-2200, USA
Abstract:In this paper, we study the localization phenomena in a slender cylinder composed of an incompressible hyperelastic material subjected to axial tension. We aim to construct the analytical solutions based on a three-dimensional setting and use the analytical results to describe the key features observed in the experiments by others. Using a novel approach of coupled series-asymptotic expansions, we derive the normal form equation of the original governing nonlinear partial differential equations. By writing the normal form equation into a first-order dynamical system and with the help of the phase plane, we manage to solve two boundary-value problems analytically. The explicit solution expressions (in terms of integrals) are obtained. By analyzing the solutions, we find that the width of the localization zone depends on the material parameters but remains almost unchanged for the same material in the post-peak region. Also, it is found that when the radius–length ratio is relatively small there is a snap-back phenomenon. These results are well in agreement with the experimental observations. Through an energy analysis, we also deduce the preferred configuration and give a prediction when a snap-through can happen. Finally, based on the maximum-energy-distortion theory, an analytical criterion for the onset of material failure is provided.
Keywords:
本文献已被 ScienceDirect 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号