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Multi-layer thin films/substrate system subjected to non-uniform misfit strains |
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| Authors: | X Feng Y Huang AJ Rosakis |
| Institution: | 1. Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China;2. Departments of Civil and Environmental Engineering and Mechanical Engineering, Northwestern University, Evanston, IL 60822, USA;3. Graduate Aeronautical Laboratory, California Institute of Technology, Pasadena, CA 91125, USA;1. Yangtse Chair Professor & Dept. Head Department of Engineering Mechanics Tsinghua University, Beijing 100084, CHINA;2. Allen E. & Marilyn M. Puckett Professor Division of Engineering & Applied Sciences Harvard University, Cambridge, MA 02138 |
| Abstract: | Current methodologies used for the inference of thin film stress through curvature measurement are strictly restricted to stress and curvature states that are assumed to remain uniform over the entire film/substrate system. These methodologies have recently been extended to a single layer of thin film deposited on a substrate subjected to the non-uniform misfit strain in the thin film. Such methodologies are further extended to multi-layer thin films deposited on a substrate in the present study. Each thin film may have its own non-uniform misfit strain. We derive relations between the stresses in each thin film and the change of system curvatures due to the deposition of each thin film. The interface shear stresses between the adjacent films and between the thin film and the substrate are also obtained from the system curvatures. This provides the basis for the experimental determination of thin film stresses in multi-layer thin films on a substrate. |
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