激光技术在塑封器件开封中的应用

引入激光技术与手动、自动酸开封相结合的新开封工艺，对小型、异形及有多块芯片的塑封器件进行开封实验。首先利用激光准确对芯片上方的塑封料进行部分刻蚀，再结合自动酸开封或手动酸开封去除芯片表面的塑封料。实验结果表明，激光开封后的器件再进行手动酸开封时间仅需8 s，相对于未引入激光开封技术的传统酸开封方法，激光开封技术在塑封器件开封中能达到定位准确、缩短开封时间、提高开封效率的效果。

Application of laser technology in decapsulation of plastic encapsulated microcircuits

The new process of laser technology combined with manual and automatic acid decapsulation is applied to decapsulation experiment of small, heteromorphic and multichip plastic encapsulated microcircuits. The laser etches the encapsulation materials above the chip accurately and incompletly, and then combines with manual and automatic acid decapsulation to remove the rest encapsulation material on the chip surface. The experimental results show that the manual and automatic acid decapsulation time is 8 s after laser decapsulation. Comparing with the traditional acid decapsulation, the laser technology in decapsulation of plastic encapsulated microcircuits can achieve accurate positioning, shortening the time of decapsulation, and improving the efficiency.