| 贴片式电子元件典型的失效模式及机理分析 |
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| 引用本文： | 贺光辉,邹雅冰,李少平,莫富尧.贴片式电子元件典型的失效模式及机理分析[J].电子工艺技术,2012(6):341-343,379. |
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| 作者姓名： | 贺光辉 邹雅冰 李少平 莫富尧 |
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| 作者单位： | 中国赛宝实验室,广东广州510610 |
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| 摘 要： | 针对贴片式电阻器和贴片式陶瓷电容器中银电极典型的腐蚀漏电失效模式,选取两个案例进行分析。通过采用X-ray、金相切片和SEM&EDS等分析手段,阐述了这类贴片式电子元件的失效机理,剖析了元件出现硫化腐蚀、电化学迁移失效与银电极制作工艺及电极浆料的关系,并提出了有效控制此类失效的措施与对策。
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| 关 键 词： | 贴片式电阻器 贴片式陶瓷电容器 贴片式电子元件 银电极 失效机理 硫化腐蚀 电化学迁移 |
Typical Failure Mode and Mechanism Analysis of Chip Components |
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| HE Guang-hui,ZOU Ya-bing,LI Shao-ping,MO Fu-yao.Typical Failure Mode and Mechanism Analysis of Chip Components[J].Electronics Process Technology,2012(6):341-343,379. |
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| Authors: | HE Guang-hui ZOU Ya-bing LI Shao-ping MO Fu-yao |
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| Institution: | (China CEPREI Labs,Guangzhou 510610,China) |
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| Abstract: | Present two typical failure cases of corrosion and electrochemical migration on the silver electrode of chip capacitors and resistors.The detailed analysis procedure and means such as X-ray inspection,cross section,SEMEDS analysis performed on the samples are introduced.Based on studying the failure mechanism,the causal association of sulfur corrosion or electrochemical migration of silver electrode and the electrode process or/and electrode paste material are analyzed.And preventive measure are analyzed and summarized. |
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| Keywords: | Chip Resistor Chip Capacitor Electronic Component Silver Electrode Sulfur Corrosion Electrochemical Migration |
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