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Curing of mixtures of diane and aliphatic epoxy oligomers with different reactivities
Authors:E S Zhavoronok  I N Senchikhin  E F Kolesnikova  A E Chalykh  M R Kiselev  V I Roldugin
Institution:1. Frumkin Institute of Physical Chemistry and Electrochemistry, Russian Academy of Sciences, Leninskii pr. 31, Moscow, 119991, Russia
2. Mendeleev University of Chemical Technology, Miusskaya pl. 9, Moscow, 125047, Russia
3. Tsiolkovsky Russian State Technological University, Orshanskaya ul. 3, Moscow, 121552, Russia
Abstract:Curing of diane and aliphatic epoxy oligomers and their blends is studied by DSC. The use of the traditional dynamic procedure and preliminary heating of the samples at a constant temperature are shown to be convenient for estimating the degree of conversion, glass-transition temperature, and activation energy of curing. Curing of diane, aliphatic epoxy oligomers, and blends with aliphatic amine is adequately described by the Kamal—Sourour equation, and the apparent activation energy of curing is 61.4–55.7 kJ/mol according to the Flynn—Wall—Ozawa model and 54.7–48.5 kJ/mol according to the Kissinger model. This value slightly changes with variation in the content of epoxy oligomers.
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