圆片上缺陷光学诊断设备的几个关键技术

简述半导体产业为追求投资回报率已经使得诊断设备由简单的工具发展成为检测缺陷、分类缺陷、分析成因、调整工艺的完善的IYM解决方案。讨论了国外诊断设备当前发展趋势。介绍了半导体圆片缺陷现场光学自动诊断设备的组成,给出了圆片诊断设备的一些重要性能指标。重点介绍了缺陷诊断设备从光机扫描成像到形成圆片图(wafermap)所采用的主要方法及其关键技术的几点考虑,包括:缺陷光散射的计算、空间信号滤波器、暗场显微技术和扫描成像技术、空间信息分析及生成圆片图等。

Several Key Technologys for Optics Diagnosis Equipments of Defects on Semiconductor Wafer

Continued pressure to increase the return-on-investment for the semiconductor fabricator has made it critical for diagnosis systems to evolve from stand-alone "tools" that just find defects to being a part of a more complete solution to Integrated Yield Management(IYM) where detecting defects, classifying them, analyzing these results and recommending corrective action are their functions. we will discuss the tendency of the rencent development of the abroad diagnosis equipments, introduce the composing of the photics automatous diagnosis equipments in the development, present some important performance indexs and more elaborately show the major technology and methods for defects inspection, including calculation of light scattering from defects on silicon surfaces, spatial signature filter, dark-field photomicrography and scanning imaging, spatial signature analysis and finishing the wafermap.