Matrix laser cleaning: a new technique for the removal of nanometer sized particles from semiconductors |
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Authors: | J Graf BS Luk’yanchuk M Mosbacher MH Hong CT Chong J Boneberg P Leiderer |
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Institution: | (1) University of Konstanz, Universitaetsstrasse 10, 78457 Konstanz, Germany;(2) Data Storage Institute, Agency for Science, Technology and Research, Singapore, 117608, Singapore |
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Abstract: | In this paper a new laser-based technique for the removal of nanoparticles from silicon wafers, called matrix laser cleaning,
is introduced. In contrast to the already existing technique dry laser cleaning damages of the substrate can be avoided. Furthermore
no liquids are used, avoiding problems that occur, e.g. in steam laser cleaning and other wet cleaning techniques. We show
that damage free particle removal of polystyrene particles with diameters of at least down to 50 nm is possible with a cleaning
efficiency very close to 100% within a single shot experiment. Furthermore the cleaning threshold is independent of the particle
size.
PACS 64.70.Hz; 68.43.Vx; 81.65.Cf |
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Keywords: | |
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