Novel materials for electronic device fabrication using ink-jet printing technology |
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Authors: | Yasushi Kumashiro Hideo Nakako Kazunori Yamamoto Masamichi Ishihara |
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Affiliation: | a Hitachi Chemical Co., Ltd., 48, Wadai, Tsukuba-shi, Ibaraki 300-4247, Japan b Kyushu Institute of Technology, 1-1 Sensuicho, Tobata, Kitakyushu-shi, Fukuoka 804-8550, Japan |
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Abstract: | Novel materials and a metallization technique for the printed electronics were studied. Insulator inks and conductive inks were investigated. For the conductive ink, the nano-sized copper particles were used as metallic sources. These particles were prepared from a copper complex by a laser irradiation process in the liquid phase. Nano-sized copper particles were consisted of a thin copper oxide layer and a metal copper core wrapped by the layer. The conductive ink showed good ink-jettability. In order to metallize the printed trace of the conductive ink on a substrate, the atomic hydrogen treatment was carried out. Atomic hydrogen was generated on a heated tungsten wire and carried on the substrate. The temperature of the substrate was up to 60 °C during the treatment. After the treatment, the conductivity of a copper trace was 3 μΩ cm. It was considered that printed wiring boards can be easily fabricated by employing the above materials. |
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Keywords: | Atomic hydrogen Laser ablation Deoxidization Ink-jet Printed wiring boards |
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