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Fundamental aspects of film formation in electrochemical polishing of silver and silver-copper alloys in thiosulfate solutions
Authors:E. P. Grishina  S. I. Galanin  O. A. Ivanova
Affiliation:(1) Institute of Chemistry of Solutions, Russian Academy of Sciences, Ivanovo, Russia;(2) Kostroma State Technological University, Kostroma, Russia
Abstract:The anodic behavior of silver and its alloys with copper in thiosulfate solutions was studied by cycling voltammetry. A scheme of an electrochemical polishing process including the stage of formation of a resistive layer of silver thiosulfate and the chemical stage of its dissolution is suggested.Translated from Zhurnal Prikladnoi Khimii, Vol. 77, No. 8, 2004, pp. 1299–1302.Original Russian Text Copyright © 2004 by Grishina, Galanin, Ivanova.
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