| 微波MCM电路的设计与制作 |
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| 引用本文： | 王钧,施建俊.微波MCM电路的设计与制作[J].电讯技术,1998,38(6):48-53. |
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| 作者姓名： | 王钧 施建俊 |
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| 作者单位： | 上海交通大学电子工程系 |
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| 摘 要： | 本文介绍一种新的封装技术－微波多芯片组件（ＭＣＭ）技术。详细阐述了其设计环节并分析了设计要点，提出了通用的设计方法。此外还介绍了微波ＭＣＭ电路的制作流程。
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| 关 键 词： | 多芯片组件 封装 微波单片 IC 集成电路 |
The Design and Manufacture of Microwave MCM Circuits |
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| Wangjun and Shijianjun.The Design and Manufacture of Microwave MCM Circuits[J].Telecommunication Engineering,1998,38(6):48-53. |
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| Authors: | Wangjun and Shijianjun |
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| Institution: | Shanghai Jiaotong University |
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| Abstract: | In this paper a novel packaging technology, Microwave MCM, was introduced. We discussed the step and key points of its design and also proposed the design method. Besides this, the manufacture sequence was also showed in this paper. |
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| Keywords: | Circuit and Device Microwave MCM Package MMIC |
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