Dynamic response of a crack in a functionally graded interface of two dissimilar piezoelectric half-planes |
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Authors: | J Chen Z Liu Z Zou |
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Institution: | (1) Department of Engineering Mechanics, Shanghai Jiaotong University, Shanghai 200030, P.R. China e-mail: chenjian130@yahoo.com.cn, CN;(2) Department of Astronautics Engineering and Mechanics, Harbin Institute of Technology, Harbin 150001, P.R. China, CN |
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Abstract: | Summary In this paper, the dynamic anti-plane crack problem of two dissimilar homogeneous piezoelectric materials bonded through
a functionally graded interfacial region is considered. Integral transforms are employed to reduce the problem to Cauchy singular
integral equations. Numerical results illustrate the effect of the loading combination parameter λ, material property distribution
and crack configuration on the dynamic stress and electric displacement intensity factors. It is found that the presence of
the dynamic electric field could impede of enhance the crack propagation depending on the time elapsed and the direction of
applied electric impact.
Received 4 December 2001; accepted for publication 9 July 2002
This work is supported by the National Natural Science Foundation of China through Grant No. 10132010. |
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Keywords: | Functionally graded material Piezoelectricity Stress intensity factor Crack |
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