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| 无铅化热风整平的焊料与选择 | |
| 引用本文： | 林金堵,曾曙.无铅化热风整平的焊料与选择[J].印制电路信息,2009(7):41-45. |
| 作者姓名： | 林金堵 曾曙 |
| 作者单位： | |
| 摘 要： | 文章概述了无铅化热风整平的焊料及其选择。在Sn—Cu中加入少量的Ni（或Co）是无铅化热风整平的焊料的有利选择。 |
| 关 键 词： | 无铅化热风整平 无铅焊料 金属间互化物 可焊接性和可靠性 焊料选择 |
Selection of Solder for Lead-Free HASL |
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| LIN Jindu,ZENG Shu.Selection of Solder for Lead-Free HASL[J].Printed Circuit Information,2009(7):41-45. | |
| Authors: | LIN Jindu ZENG Shu |
| Abstract: | The paper describes that the solder and selection of lead-free solder in HASL.The best-selection of lead-free solder is that the additive-small Ni(or Co) in Sn-Cu systems. |
| Keywords: | lead-free HASL lead-free solder IMC solderability and reliability soldering selection |
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