Formulation and characterization of anisotropic conductive adhesive paste for microelectronics packaging applications |
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Authors: | Liqiang Cao Shiming Li Zonghe Lai Johan Liu |
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Affiliation: | 1.Division of Electronics Production,Chalmers University of Technology, c/o IVF,M?lndal,Sweden |
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Abstract: | There has been a steadily increasing interest in using electrically conductive adhesives as interconnecting materials in electronics manufacturing. In this paper, several anisotropic conductive adhesive (ACA) pastes were formulated, which consist of diglycidyl ether of bisphenol F or diglycidyl ether of bisphenol A as polymer matrix, imidazoles as curing agents, and different sizes of silver (Ag) powders or gold (Au)-coated polymer spheres as conductive particles. The effects of ACA resin and different curing agents, as well as different conductive particles, on flexible substrate of the flip-chip joint were studied. The results show that the size and type of different conductive particles have very limited influence on an ACA flip-chip joint. The ACA resin as well as the curing agent can affect the reliability of the joint. The same results can be applied for the failure analysis of ACA flip-chip technology. |
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Keywords: | Anisotropic conductive adhesive (ACA) flip-chip failure analysis |
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