Topology optimization and heat dissipation performance analysis of a micro-channel heat sink

Junction temperature in the electronic packaging process is one of the critical factors affecting the service life of electronic devices. A micro-channel heat sink is a common heat dissipating device used to reduce the thermal resistance between components and substrate. In order to maximize the heat dissipation while minimizing the pressure drop, this paper adopts a topology optimization method. A material interpolation method based on variable density principle is used together with a moving asymptote algorithm for the optimization. The physics is governed by the heat and mass transfer, coupled with the momentum conservation in the fluid. Four parameters are varied in order to investigate their influence on the optimization process. A three-dimensional geometry has been constructed to study the flow field and the results are compared to a reference case to verify the temperature uniformity and thermal performance of the model. It is demonstrated that the optimized design of the micro-channel heat sink is reliable and effective.