Ni颗粒增强无铅复合钎料中IMC形态之演变

通过改变钎焊工艺曲线来控制热输入量。研究了Ni颗粒周围金属间化合物(IMC)以及钎料/基板界面处IMC的形态演变。结果表明,随着热输入量由低变高,Ni颗粒周围IMC形态从向日葵状向多边形状发展,最终成为遍布整个钎料层的细碎的IMC形态;而钎料/基板界面层,因Ni颗粒的加入,出现大量的三维孔洞状IMC。从而形成了Cu元素扩散的通道,使得界面层厚度增加且呈线性增长趋势。

Morphology evolution of intermetallic compounds in nickel particlereinforced lead-free composite solder

The amount of the thermal input was controlled by changing the temperature profiles during the soldering process in the current investigation. The evolution of the morphologies of intermetallic compound (IMC) both around Ni particles and at the solder/Cu substrate interface in Sn-Ag based nickel particle reinforced lead-free composite solder was investigated. The IMCs developed from "sunflower" to "blocky" morphology with the increase of thermal input and eventually spread all over the bulk solder region. Significant amount of three-dimensional hollow IMCs are observed in the microstructure due to the addition of Ni particles,which is considered to serve as effective paths for Cu diffusion. Therefore,the thickness of interfacial IMC layer increased linearly with thermal input.